We provide 3D structure verification metrology services through light-source-driven technology, capable of measuring wafer topography, critical dimensions, thin-film thickness and alignment with nanometer-level precision.
Our NDT approach captures even the smallest and buried features without wafer contact, verifying that every layer meets the strictest quality standards.
From FEOL to advanced packaging, our 3D verification ensures every layer of your semiconductor devices aligns perfectly with design specifications. By making the invisible measurable, we provide the insights needed for the next generation of semiconductor innovation.
We provide 3D structure verification metrology services through light-source-driven technology, capable of measuring wafer topography, critical dimensions, thin-film thickness and alignment with nanometer-level precision.
Our NDT approach captures even the smallest and buried features without wafer contact, verifying that every layer meets the strictest quality standards.
From FEOL to advanced packaging, our 3D verification ensures every layer of your semiconductor devices aligns perfectly with design specifications. By making the invisible measurable, we provide the insights needed for the next generation of semiconductor innovation.