At Global TechSolutions, we provide comprehensive 3D structure verification and wafer inspection metrology services for semiconductor process control. Leveraging light-source-driven technology, our solutions measure wafer topography, critical dimensions, thin-film thickness, and alignment with nanometer-level precision.

Our non-contact, patented inspection approach captures even the smallest and buried features in both air and water environments, ensuring minimal operator handling, high throughput, and consistent repeatability. We offer thickness measurement, film uniformity mapping, and topography analysis tailored for 200mm and 300mm production lines.

From FEOL to advanced packaging, our 3D verification ensures every layer of your semiconductor devices aligns perfectly with design specifications. By making the invisible measurable, we deliver the insights needed to drive the next generation of semiconductor innovation.