ZEISS XENOS
ZEISS XENOS
Ultra-High Precision Metrology at the Limits of Nanometre Accuracy
Where mechanical tolerances demand absolute limits of measurement certainty, the ZEISS XENOS sets a new global standard. Engineered for aerospace institutions, premier calibration laboratories, and semiconductor research facilities, this machine breaks traditional barriers to deliver an unparalleled length measurement error of just 0.3 + L/1000 micrometers.
By redesigning the traditional CMM bridge architecture and utilizing advanced material sciences, the platform ensures flawless mechanical reproducibility and virtual zero thermal expansion, capturing the most minute structural characteristics with absolute data integrity.
Key Capabilities
Virtual Zero Thermal Expansion
The structural components are crafted entirely from silicon carbide ceramics. This advanced material provides up to 50% lower thermal expansion and significantly greater rigidity compared to standard alumina ceramics, eliminating ambient temperature-induced measurement errors.
Innovative Stationary Bridge Architecture
Unlike standard bridge-type systems where the crossbeam moves, the machine features a fixed portal layout. Only the measuring table travels in the Y-axis direction, completely separating the driving forces from the probe tracking mechanics to maintain exceptional dynamic geometry.
Linear Drive Frictionless Displacement
All axes utilize high-performance linear drives instead of traditional ballscrews. This eliminates mechanical backlashes, structural vibrations, and friction-induced micro-stretching, allowing the probe system to execute ultra-smooth travel paths down to single-digit nanometre resolutions.
Virtual Central Drive Alignment
The driving mechanisms on the moving axes are positioned precisely in line with the center of gravity of the structural assemblies. This unique configuration prevents twisting moments and dynamic pitch errors during acceleration cycles.
High-Resolution Optoelectronic Grating Scales
Equipped with real-time laser-interferometric scale technologies that track positioning changes with a sensor resolution of just 1 nanometre, providing exceptional measurement stability across the entire volume.
Integrated Active Thermal Insulation Grid
The entire machine envelope is shielded by high-efficiency insulation layers alongside liquid-cooled motor housings, trapping micro-heat outputs and bleeding them away from the metrology workspace seamlessly.
Why Choose ZEISS XENOS?
Ultimate Metrology Maturity and Authority
Stands as the supreme standard in global dimensional metrology. It represents total product maturity, often serving as the master instrument against which an entire company’s reference standards are verified.
Maximised Volumetric Repeatability
The unique fixed-portal design maintains constant mass distribution regardless of probe position. This ensures that the accuracy profile remains uniform whether measuring at the center of the table or at the absolute outer boundaries of the volume.
Heavy Stylus Configuration Handling
The active tactile probing mechanics can deploy complex, multi-sided stylus trees weighing up to several hundred grams without introducing gravitational deflection or slowing down the feedback loops.
Advanced Data Density for Complex GD&T
Optimized for complex Geometric Dimensioning and Tolerancing (GD&T) evaluations, capturing thousands of dense surface coordinate matrices continuously to accurately map profile errors on highly intricate geometries.
Industry 4.0 Integration & Calibration Logs
Fully compatible with ZEISS Smart Services, allowing research directors to track environmental stability profiles, machine calibration intervals, and usage statistics remotely via an encrypted digital platform.
Ergonomic Part Accessibility
The open structure from the front and rear allows large calibration objects, custom granite fixtures, or heavy tooling standards to be loaded cleanly without risking collision damage with the moving bridge frame.
Sensors
ZEISS VAST gold
A heavy-duty active probe built for high-speed tactile scanning and single-point inspection using long, complex stylus extensions.
Applications
National and Corporate Reference Standards
Serving as the core master verification system for national laboratories or corporate quality networks to certify master rings, reference spheres, and gauges.
Semiconductor Lithography Components
Inspecting the structural frames, ultra-precise mirrors, and optical alignment fixtures used inside advanced silicon wafer scanner units where tolerances approach sub-micron levels.
Aerospace & Defence Guidance Systems
Verifying high-criticality mechanical gyroscopes, missile guidance housings, and advanced optical telescope housings demanding maximum manufacturing precision.
Ultra-Precision Micro-Moulding
Evaluating diamond-turned optical moulds, injection matrices, and master prototypes where even a microscopic surface finish anomaly renders the workpiece unusable.
Learn more about ZEISS XENOS
See all features, benefits, and applications in one brochure.
ZEISS CALYPSO Software
Software for dimensional measurement technology
ZEISS CALYPSO enables fast and reliable measurement of standard geometries with intuitive inspection plan creation and automated probe path generation. Optional extensions support advanced probing and optimized measurement sequences, helping reduce inspection time and improve efficiency.
Contact Us for a Demo
Whether you need a live demo with your own parts or expert measurement services, our specialists are ready to support your quality assurance needs.