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07

JAN
2026

Advanced packaging is set to drive the semiconductor industry’s next leap, with the market projected to grow from US$46B in 2024 to US$79.4B by 2030 as compute, memory, and I/O move closer together to shorten data paths, reduce power, and boost performance.

SMEs play a pivotal role in supporting MNCs by providing last-mile capabilities, localising spares and supplier qualification, accelerating time-to-qualification, and protecting uptime.

By collaborating closely with MNCs, SMEs turn innovation into repeatable, compliant production, building institutional knowledge, training talent, and strengthening the local ecosystem.

Read more in this article by our CEO, Kenneth Lee Wee Ching, where he shares his insights on why SMEs are critical to scaling advanced packaging.